The upcoming Honor Magic9 could launch with Qualcomm’s Snapdragon 8 Elite Gen 5 processor, according to a fresh leak from tipster Digital Chat Station. The leak adds more details about the compact flagship phone, which has recently appeared in several online reports.
The tipster claims that the Honor Magic9 will use a 3nm Snapdragon 8 Elite Gen 5 chipset. Interestingly, the current-generation Honor Magic8 is also said to use the same processor.
Earlier leaks had suggested that the Honor Magic9 may feature a 6.36-inch display and a large 8,000mAh battery. If accurate, the battery capacity could become one of the biggest highlights of the compact smartphone.
The latest leak also reveals new information about the zoom camera. The phone is tipped to include a 64MP periscope telephoto camera based on an upgraded version of the OV64D sensor. Previous reports had also claimed that the device could feature a 200MP primary rear camera and a 50MP ultra-wide sensor.
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In addition to camera upgrades, the Honor Magic9 is expected to support wireless charging. The device may also include a 3D ultrasonic fingerprint scanner for biometric security.
The handset is further tipped to carry IP68 and IP69 ratings for dust and water resistance. These ratings usually indicate better protection against water exposure and dust entry.
Honor has not officially confirmed the specifications or launch timeline of the Magic9 series so far. More details about the smartphone are expected to surface in the coming months as leaks and certifications continue to appear online.
