Huawei has announced that its upcoming Mate 90 smartphone series will feature a new-generation Kirin chipset designed with the company’s LogicFolding architecture. The company said the chip will deliver performance comparable to modern 3nm mobile processors.
The announcement came during a keynote session at the Phoenix Bay Area Finance Forum and Financial Summit in Shenzhen. Huawei recently introduced its new Tao Scaling Law and LogicFolding architecture, which it says improves chip efficiency and performance.
According to Huawei, the upcoming Kirin chip will be the company’s first mobile processor built using the LogicFolding design. However, the company did not confirm that the chip itself is manufactured on a 3nm process. Instead, officials said its performance level would match current 3nm-class chips.
Huawei claimed the new architecture increases transistor density by 53.5%. The company also said the design improves overall chip performance by 41% and raises peak frequency by 12.7%. These changes are also expected to improve power efficiency.
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The exact name of the new Kirin chipset has not yet been revealed. Huawei is expected to share more details closer to the launch of the Mate 90 series later this year.
The development is important for the smartphone industry because chip performance and power efficiency remain key factors in premium mobile devices. Huawei’s latest claims suggest the company is continuing to focus on advanced in-house chip development despite ongoing competition in the global smartphone market.
More official information about the chipset and the Mate 90 lineup is likely to emerge in the coming months ahead of the expected fall launch.
