The upcoming Honor Magic9 Pro Max has surfaced online ahead of its expected launch later this year. The latest leak reveals key hardware features, including a large battery, high-resolution cameras, and a flagship Qualcomm processor.
According to the leaked information, the phone may feature a 6.8-inch to 6.89-inch LTPO OLED display with “1.5K” resolution and 2.5D curved glass. LTPO panels help improve battery efficiency by adjusting the refresh rate based on usage.
The device is also tipped to include a 200MP main camera with a 1/1.28-inch sensor. Another 200MP periscope telephoto camera is expected for long-range zoom photography. If accurate, the setup would place the phone among the highest-resolution camera devices in the premium segment.
The leak further claims the handset will support an ultrasonic fingerprint scanner and 3D face unlock. These features are commonly used in flagship phones for faster and more secure authentication.
On the battery side, the phone could pack a battery capacity between 8,000mAh and 8,999mAh. The exact size is still unclear, but the leak suggests it will begin with the number eight. The device is also expected to support high-power wireless charging and offer strong water resistance.
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The smartphone may run on Qualcomm’s upcoming Snapdragon 8 Elite Gen 6 chipset. However, it is not yet confirmed whether Honor will use the standard Gen 6 version or the more powerful Gen 6 Pro variant.
The current Honor Magic8 series was launched in October last year. Based on that timeline, the Magic9 family could arrive around October this year as well.
Honor has not officially confirmed these specifications or the launch date so far. More details are expected to emerge closer to the announcement.
